FH8065301989700S R3V3

Intel
607-65301989700SR3V3
FH8065301989700S R3V3

Mfr.:

Description:
CPU - Central Processing Units 64BIT MPU 8065301989 700 1.33G 1MB FCBGA

ECAD Model:
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In Stock: 26

Stock:
26 Can Dispatch Immediately
Factory Lead Time:
3 Weeks Estimated factory production time for quantities greater than shown.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
39,00 € 39,00 €
33,36 € 333,60 €
31,96 € 799,00 €
27,92 € 2 792,00 €
26,88 € 6 720,00 €
500 Quote

Product Attribute Attribute Value Select Attribute
Intel
Product Category: CPU - Central Processing Units
RoHS:  
Embedded Processors
Intel Atom E3805
64 bit
2 Core
FCBGA-1170
1.33 GHz
1 MB
2 Thread
3 W
8 GB
DDR3L-1067
Intel Atom
Bay Trail
E3805
Embedded
- 40 C
+ 110 C
Tray
Brand: Intel
ECC Memory Supported: Supported
Intel Hyper-Threading Technology: Without HT Technology
Intel Virtualisation Technology - VT: With VT
Interface Type: Serial
Lithography - Process Technology: 22 nm
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Number of Memory Channels: 1 Channel
Number of PCI Express Lanes: 4 Lane
Number of SATA Ports: 2 Port
PCIe Configurations: x4, x2, x1
PCIe Revision: Revision 2.0
Product Type: CPU - Central Processing Units
Series: E3805
Factory Pack Quantity: 1
Subcategory: Embedded Processors & Controllers
Tradename: Atom
USB Revision: Revision 2.0, 3.0
Part # Aliases: 962772
Unit Weight: 98,236 g
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Attributes selected: 0

TARIC:
8542319000
CNHTS:
8542319090
USHTS:
8542310045
ECCN:
5A992.C

E3800 Atom Processor

Intel's E3800 Atom Processor family is based on the Silvermont microarchitecture, and utilizes Intel's industry-leading 22nm process technology with 3-D Tri-Gate transistors to deliver significant improvements in computational performance and energy-efficiency in intelligent systems. It is the first system-on-chip (SoC) designed for intelligent systems, delivering outstanding compute, graphical and media performance while operating in an extended range of thermal conditions. Highlights include high I/O connectivity, integrated memory controller, virtualization, Error Correcting Code (ECC), and built-in security capabilities with a thermal design power (TDP) range of 5W to 10W. This product family is ideal for efficient imaging workflows, digital signage with secure content delivery, visually appealing interactive clients (interactive kiosks, intelligent vending, ATM and point-of-sale (POS) terminals, portable medical devices, industrial control systems, and in-vehicle infotainment (IVI) systems.
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