- 40 C DRAM

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Type
Memory Size
Data Bus Width
Maximum Clock Frequency
Package/Case
Organisation
Access Time
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
AP Memory DRAM IoT RAM 256Mb OPI (x8,x16) DDR 200MHz, 1.8V, Ind. Temp., WLCSP Suggested Alt APS256XXN-OB9-WA same density NRND Non-Stocked Lead-Time 20 Weeks
Min.: 5 000
Mult.: 5 000
: 5 000

PSRAM (Pseudo SRAM) 256 Mbit 8 bit / 16 bit 200 MHz WLCSP-24 32 M x 8/16 M x 16 1.62 V 1.98 V - 40 C + 85 C IoT RAM Reel
AP Memory DRAM IoT RAM 64Mb QSPI (x1,x4) SDR 144MHz, HS, 1.8V, Ind. Temp, WLCSP
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 5 000
Mult.: 5 000
: 5 000

PSRAM (Pseudo SRAM) 64 Mbit 4 bit / 1 bit 144 MHz WLCSP-8 8 M x 8 1.62 V 1.98 V - 40 C + 85 C IoT RAM Reel
AP Memory DRAM IoT RAM 64Mb OPI (x8) DDR 200MHz, 1.8V, Ind. Temp., WLCSP Non-Stocked Lead-Time 20 Weeks
Min.: 5 000
Mult.: 5 000
: 5 000

PSRAM (Pseudo SRAM) 64 Mbit 8 bit 200 MHz WLCSP-13 8 M x 8 1.62 V 1.98 V - 40 C + 85 C IoT RAM Reel
AP Memory DRAM IoT RAM 64Mb OPI (x8) DDR 200MHz, 1.8V, Ext. Temp., BGA24
Datasheet
Lead-Time 20 Weeks
Min.: 1
Mult.: 1

PSRAM (Pseudo SRAM) 64 Mbit 8 bit 200 MHz BGA-24 8 M x 8 1.62 V 1.98 V - 40 C + 105 C IoT RAM Tray
Intelligent Memory DRAM SDRAM, 64Mb, 3.3V, 2Mx32, 166MHz (166Mbps), -40C to +85C, FBGA-54
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 190
Mult.: 190

SDRAM 64 Mbit 32 bit 166 MHz FBGA-90 2 M x 32 5.4 ns 3 V 3.6 V - 40 C + 85 C IM6432SD Tray
Intelligent Memory DRAM DDR3 8Gb, 1.35V/1.5V, 512Mx16 (2CS), 933MHz (1866Mbps), -40C to +95C, FBGA-96
Datasheet
Non-Stocked Lead-Time 6 Weeks
Min.: 180
Mult.: 180

SDRAM - DDR3L 8 Gbit 16 bit 933 MHz FBGA-96 512 M x 16 20 ns 1.283 V 1.45 V - 40 C + 95 C IM8G16D3 Tray
GSI Technology DRAM 16M x 18 (288Meg) LLDRAM II Common I/O
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

LLDRAM II 288 Mbit 18 bit 533 MHz uBGA-144 16 M x 18 1.7 V 1.9 V - 40 C + 95 C Tray
GSI Technology DRAM 16M x 18 (288Meg) LLDRAM II Common I/O
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

LLDRAM II 288 Mbit 18 bit 533 MHz uBGA-144 16 M x 18 1.7 V 1.9 V - 40 C + 95 C Tray
GSI Technology DRAM 32M x 18 (288Meg) LLDRAM II Common I/O
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

SDRAM - DDR 576 Mbit 18 bit 400 MHz uBGA-144 32 M x 18 1.7 V 1.9 V - 40 C + 95 C Tray
GSI Technology DRAM 32M x 18 (288Meg) LLDRAM II Common I/O
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

SDRAM - DDR 576 Mbit 18 bit 400 MHz uBGA-144 32 M x 18 20 ns 1.7 V 1.9 V - 40 C + 95 C Tray
GSI Technology DRAM 16M x 36 (288Meg) LLDRAM II Common I/O
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

SDRAM - DDR 576 Mbit 36 bit 533 MHz uBGA-144 16 M x 36 1.7 V 1.9 V - 40 C + 95 C Tray
GSI Technology DRAM 16M x 36 (288Meg) LLDRAM II Common I/O
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

SDRAM - DDR 576 Mbit 36 bit 400 MHz uBGA-144 16 M x 36 1.7 V 1.9 V - 40 C + 95 C Tray
GSI Technology DRAM 16M x 36 (288Meg) LLDRAM II Common I/O
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

SDRAM - DDR 576 Mbit 36 bit 400 MHz uBGA-144 16 M x 36 20 ns 1.7 V 1.9 V - 40 C + 95 C Tray
Intelligent Memory DRAM ECC DDR3, 1Gb, 1.5V, 128Mx8, 667MHz (1333Mbps), -40C to +95C, FBGA-78
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 242
Mult.: 242

SDRAM - DDR3 1 Gbit 8 bit 667 MHz FBGA-78 128 M x 8 20 ns 1.425 V 1.575 V - 40 C + 95 C IME1G08D3 Tray
Winbond W958S6NBJX4I
Winbond DRAM 256Mb HyperRAM x16, 250MHz, Ind temp, 1.2V Non-Stocked Lead-Time 36 Weeks
Min.: 1
Mult.: 1

HyperRAM 256 MB 250 MHz - 40 C + 85 C Tray
Winbond W958S8NBPA4I
Winbond DRAM 256Mb HyperRAM x8, 250MHz, Ind temp, 1.2V Non-Stocked Lead-Time 36 Weeks
Min.: 1
Mult.: 1

HyperRAM 256 MB 250 MHz - 40 C + 85 C Tray
Winbond W958S8NMPA4I
Winbond DRAM 256Mb HyperRAM x8, 250MHz, Ind temp, 1.2V Non-Stocked Lead-Time 36 Weeks
Min.: 1
Mult.: 1

HyperRAM 256 MB 250 MHz - 40 C + 85 C Tray
Winbond W959S6NBJX4I
Winbond DRAM 512Mb HyperRAM x16, 250MHz, Ind temp, 1.2V Non-Stocked Lead-Time 36 Weeks
Min.: 1
Mult.: 1

HyperRAM 512 MB 250 MHz - 40 C + 85 C Tray
Winbond W959S8NMPA4I
Winbond DRAM 512Mb HyperRAM x8, 250MHz, Ind temp, 1.2V Non-Stocked Lead-Time 36 Weeks
Min.: 1
Mult.: 1

HyperRAM 512 MB 250 MHz - 40 C + 85 C Tray
Infineon Technologies S80KS2564GACHA040
Infineon Technologies DRAM SPCM
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 260
Mult.: 260

HyperRAM 256 Mbit 16 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 85 C Tray
Infineon Technologies S80KS2564GACHA043
Infineon Technologies DRAM SPCM
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

HyperRAM 256 Mbit 32 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 85 C Reel
Infineon Technologies S80KS2564GACHB040
Infineon Technologies DRAM SPCM
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 260
Mult.: 260

HyperRAM 256 Mbit 32 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 105 C Tray
Infineon Technologies S80KS2564GACHB043
Infineon Technologies DRAM SPCM
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

HyperRAM 256 Mbit 16 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 105 C Reel
Infineon Technologies S27KL0643GABHV020
Infineon Technologies DRAM SPCM
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 3 380
Mult.: 3 380

HyperRAM 64 Mbit 8 bit 200 MHz 8 M x 8 35 ns 2.7 V 3.6 V - 40 C + 105 C Tray
Infineon Technologies S70KL1283DPBHV020
Infineon Technologies DRAM SPCM
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

HyperRAM 128 Mbit 8 bit 166 MHz 16 M x 8 36 ns 2.7 V 3.6 V - 40 C + 105 C Tray