+ 75 C Multiprotocol Modules

Results: 192
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Bluetooth, BLE - 802.15.1 Protocol - Cellular, NBIoT, LTE Protocol - GPS, GLONASS Protocol - WiFi - 802.11 Product Packaging
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz Audio, Bluetooth, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, SD Card, UART, USB, USIM, Video, WiFi 4 V 4 V - 35 C + 75 C 44 mm x 43 mm x 2.85 mm Bluetooth, BLE GSM/EDGE, WCDMA GNSS LTE Cat 6, WiFi, Bluetooth
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz Audio, Bluetooth, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, SD Card, UART, USB, USIM, Video, WiFi 4 V 4 V - 35 C + 75 C 44 mm x 43 mm x 2.85 mm BLE, Bluetooth GNSS 802.11 a/b/g/n
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

900 MHz, 1.8 GHz, 2.4 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, PWM, SPI, UART, USB 2.0, VGA 3.5 V 4.2 V - 30 C + 75 C 35 mm x 31 mm x 2.65 mm Bluetooth 2.1 + EDR, Bluetooth 4.2 LTE Cat 4 BDS, GLONASS, GPS 802.11 b/g/n 802.11 b/g/n, Bluetooth 2.1 + EDR, Bluetooth 4.2, BDS, GLONASS, GPS
Quectel Multiprotocol Modules NRE may apply, please contact sales
Non-Stocked Lead-Time 8 Weeks
Min.: 560
Mult.: 80
: 80

2.4 GHz, 5 GHz, 6 GHz ADC, Audio, GPIO, I2C, ISP, MIPI-CSI, MIPI-DSI, PWM, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 56.5 mm x 42.5 mm x 2.95 mm Bluetooth 2.1 + EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.1 LTE Cat 15 BDS, Galileo, GLONASS, GPS, NavIC, QZSS, SBAS 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, Bluetooth 2.1 + EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.1, BDS, Galileo, GLONASS, GPS, NavIC, QZSS, SBAS, LTE Cat 6 Reel
Quectel Multiprotocol Modules GSM/GPRS/GNSS, Quad-band, Supports BT3.0 only, Ultra-small, LCC form factor Non-Stocked Lead-Time 12 Weeks
Min.: 250
Mult.: 250
: 250

MC60 1.561 GHz, 1.575 GHz, 1.602 GHz 2 W Audio, Bluetooth, PCM, SD Card, UART 3.3 V 4.6 V - 35 C + 75 C 18.7 mm x 16 mm x 2.1 mm Bluetooth 3.0 GSM/GPRS GNSS Bluetooth, GSM/GPRS, GNSS Reel
Quectel Multiprotocol Modules GSM/GPRS/GNSS, Quad-band, Supports BT3.0 & BT4.0, Ultra-small, LCC form factor Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1
: 250

1.561 GHz, 1.575 GHz, 1.602 GHz 2 W Audio, Bluetooth, PCM, SD Card, UART 3.3 V 4.6 V - 35 C + 75 C 18.7 mm x 16 mm x 2.1 mm Bluetooth 3.0 GSM/GPRS GNSS Bluetooth, GSM/GPRS, GNSS Reel, Cut Tape
Quectel Multiprotocol Modules SC200E with eMCP memory. Recommended to use discrete memory option for better pricing(EAU >2000pcs) Non-Stocked Lead-Time 18 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, BDS, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, Galileo, GLONASS, GPS, LTE Cat 4, QZSS, SBAS Reel
Quectel Multiprotocol Modules SC200E with eMCP memory. Recommended to use discrete memory option for better pricing(EAU >2000pcs)
Non-Stocked Lead-Time 18 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, BDS, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, Galileo, GLONASS, GPS, LTE Cat 4, QZSS, SBAS Reel
Quectel Multiprotocol Modules SC200E with eMCP memory(EAU >2000pcs) Non-Stocked Lead-Time 18 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 Reel
Quectel Multiprotocol Modules Longevity till 2030, Linux version (EAU >2000pcs) Non-Stocked Lead-Time 20 Weeks
Min.: 600
Mult.: 200
: 200
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SDIO, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, LTE Cat 4 Reel
Quectel Multiprotocol Modules cloud enabled, Cat 1 + 3G + 2G, MQTT, 1Gbit ROM+1Gbit RAM, Global Non-Stocked Lead-Time 24 Weeks
Min.: 250
Mult.: 250
: 250
33 dBm ADC, I2C, PCM, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE Cat 1 BDS, Galileo, GPS, GLONASS, QZSS BDS, Galileo, GPS, GLONASS, QZSS, LTE Cat 1 Reel
Quectel Multiprotocol Modules No connectivity. 2+32GB variant. Consumer temperature range(EAU >2000pcs) Non-Stocked Lead-Time 20 Weeks
Min.: 600
Mult.: 200
: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel
Quectel Multiprotocol Modules No connectivity. 4+32GB variant. Consumer temperature range(EAU >2000pcs) Non-Stocked Lead-Time 20 Weeks
Min.: 600
Mult.: 200
: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel
Quectel Multiprotocol Modules Wi-Fi /BT variant. 1+8GB - Consumer temperature range(EAU >2000pcs)
Non-Stocked Lead-Time 20 Weeks
Min.: 600
Mult.: 200
: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel
Quectel Multiprotocol Modules Wi-Fi /BT variant.2+32GB - Consumer temperature range(EAU >2000pcs)
Non-Stocked Lead-Time 20 Weeks
Min.: 600
Mult.: 200
: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel
Quectel Multiprotocol Modules Wi-Fi /BT variant.4+32GB - Consumer temperature range(EAU >2000pcs)
Non-Stocked Lead-Time 20 Weeks
Min.: 600
Mult.: 200
: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel
Quectel Multiprotocol Modules Wi-Fi /BT variant. 8+64GB - Consumer temperature range Do Not promote
Non-Stocked Lead-Time 20 Weeks
Min.: 600
Mult.: 200
: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Reel
Quectel Multiprotocol Modules (EAU >2000pcs) Non-Stocked Lead-Time 18 Weeks
Min.: 560
Mult.: 80
: 80
2.4 GHz, 5 GHz, 6 GHz ADC, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, PCIe, PWM, SPI, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 56.5 mm x 42.5 mm x 2.95 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, Bluetooth 5.2 Reel
Quectel Multiprotocol Modules 5G R17 Redcap, 5G SA only, LTE CAT4, miniPCIe FF, Global version (newer PCB revision) Non-Stocked Lead-Time 30 Weeks
Min.: 100
Mult.: 100
PCIe, PCM, USB 2.0 3.135 V 4.4 V - 30 C + 75 C 5G BDS, Galileo, GLONASS, GPS, QZSS 5G, BDS, Galileo, GLONASS, GPS, QZSS Tray
Quectel Multiprotocol Modules 5G R17 Redcap, 5G SA only, LTE CAT4, LGA package, Global version (newer PCB revision) Non-Stocked Lead-Time 30 Weeks
Min.: 250
Mult.: 250
: 250
PCIe, PCM, USB 2.0 3.135 V 4.4 V - 30 C + 75 C 5G BDS, Galileo, GLONASS, GPS, QZSS 5G, BDS, Galileo, GLONASS, GPS, QZSS Reel
Quectel Multiprotocol Modules Cat M1/ NB2 / NB-IoT NTN Module (Global coverage over GEO constellation) Non-Stocked Lead-Time 18 Weeks
Min.: 1
Mult.: 1
: 500
23 dBm ADC, GPIO, I2C, USB 2.0 2.2 V 4.35 V - 35 C + 75 C 14.9 mm x 12.9 mm x 1.9 mm LTE Cat M1/NB2, NB-IoT GLONASS, GPS GLONASS, GPS, LTE Cat M1/NB2, NB-IoT Reel, Cut Tape
Quectel Multiprotocol Modules cloud enabled, Cat M1/Cat NB2, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency) Non-Stocked Lead-Time 20 Weeks
Min.: 250
Mult.: 250
: 250
21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS BDS, Galileo, GLONASS, GPS, LTE Cat M1/NB2 Reel
Quectel Multiprotocol Modules cloud enabled, Cat M1/Cat NB2/EGPRS, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency), Data ONLY! Non-Stocked Lead-Time 20 Weeks
Min.: 250
Mult.: 250
: 250
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS BDS, EGPRS, Galileo, GLONASS, GPS, LTE Cat M1/NB2 Reel
Quectel Multiprotocol Modules Cat M1/Cat NB2/EGPRS + GNSS (w/o WWAN concurrency), VoLTE Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS EGPRS, GNSS, LTE CatM1, LTE Cat NB2 Reel, Cut Tape
Quectel Multiprotocol Modules Cat M1/Cat NB2 - QuecOpen + GNSS (w/o WWAN concurrency) Non-Stocked Lead-Time 22 Weeks
Min.: 500
Mult.: 500
: 500

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GNSS GNSS, LTE CatM1/NB2 Reel