ADLINK Technology Enclosures for Single Board Computing

Results: 4
Select Image Part #
 Mfr.
Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Type
Material
For Use With
ADLINK Technology AmSTX-CF Cooler Pizza BOX
ADLINK Technology Enclosures for Single Board Computing Size:282x249x138mm;Outer facing: A case, 230g/m2;Medium Paper: 100g/m2;Pressure: 14kgf/cm2 Non-Stocked
Min.: 1
Mult.: 1
Cases AMSTX-CF Series
ADLINK Technology AMSTX-CF CPU Backing Plate
ADLINK Technology Enclosures for Single Board Computing 1.32-50015-0100-A02.Retention, Material=SPCC t=2.0mm,Extrude M3.0xP0.503.Mylar with adhesive4.Backplate_75x75mm5.nut step=6.0mm Non-Stocked
Min.: 1
Mult.: 1
Accessories CPU Backing Plate AMSTX-CF Series
ADLINK Technology AmSTX-CF Large EPE Bottom
ADLINK Technology Enclosures for Single Board Computing Size: 256x243x81mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: Pink.ESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms Non-Stocked
Min.: 1
Mult.: 1
Accessories Large EPE Bottom Expanded Polyethylene (EPE) AMSTX-CF Series
ADLINK Technology AmSTX-CF Large EPE Top
ADLINK Technology Enclosures for Single Board Computing Size: 256x243x50mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: PinkESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms Non-Stocked
Min.: 1
Mult.: 1
Accessories Large EPE Top Expanded Polyethylene (EPE) AMSTX-CF Series