Power Modules IGBT Modules

Results: 40
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Configuration Collector- Emitter Voltage VCEO Max Collector-Emitter Saturation Voltage Continuous Collector Current at 25 C Gate-Emitter Leakage Current Pd - Power Dissipation Package/Case Minimum Operating Temperature Maximum Operating Temperature Mounting Style Technology Packaging
Microchip Technology APTGX300TL120G
Microchip Technology IGBT Modules PM-IGBT-TFS-SP6C Non-Stocked Lead-Time 26 Weeks
Min.: 3
Mult.: 1

Power Modules 3-Level Inverter 1.2 kV 1.8 V 415 A 200 nA 1.02 kW SP6C - 40 C + 125 C Screw Mount Si
Microchip Technology APTGX400A120D3G
Microchip Technology IGBT Modules PM-IGBT-TFS-D3 Non-Stocked Lead-Time 26 Weeks
Min.: 4
Mult.: 1

Power Modules Half Bridge 1.2 kV 1.8 V 535 A 200 nA 1.293 kW D3 - 40 C + 125 C Screw Mount Si
Microchip Technology APTGX450A120T6G
Microchip Technology IGBT Modules PM-IGBT-TFS-SP6C Non-Stocked Lead-Time 26 Weeks
Min.: 4
Mult.: 1

Power Modules Half Bridge 1.2 kV 1.8 V 605 A 300 nA 1.456 kW SP6C - 40 C + 125 C Screw Mount Si
Microchip Technology APTGX450DU120T6G
Microchip Technology IGBT Modules PM-IGBT-TFS-SP6C Non-Stocked Lead-Time 26 Weeks
Min.: 4
Mult.: 1

Power Modules Dual Common Emitter 1.2 kV 1.8 V 605 A 300 nA 1.456 kW SP6C - 40 C + 125 C Screw Mount Si
Microchip Technology APTGX50H120T1G
Microchip Technology IGBT Modules PM-IGBT-TFS-SP1F Non-Stocked Lead-Time 26 Weeks
Min.: 10
Mult.: 1

Power Modules Full Bridge 1.2 kV 1.8 V 90 A 150 nA 276 W SP1F - 40 C + 125 C Press Fit Si
Microchip Technology APTGX50TA120T3AG
Microchip Technology IGBT Modules PM-IGBT-TFS-SP3F Non-Stocked Lead-Time 26 Weeks
Min.: 6
Mult.: 1

Power Modules 3-Phase 1.2 kV 1.8 V 108 A 150 nA 377 W SP3F - 40 C + 125 C Press Fit Si
Microchip Technology APTGX600A120D3G
Microchip Technology IGBT Modules PM-IGBT-TFS-D3 Non-Stocked Lead-Time 26 Weeks
Min.: 3
Mult.: 1

Power Modules Half Bridge 1.2 kV 1.8 V 805 A 400 nA 1.923 kW D3 - 40 C + 125 C Screw Mount Si
Microchip Technology APTGX600A120T6G
Microchip Technology IGBT Modules PM-IGBT-TFS-SP6C Non-Stocked Lead-Time 26 Weeks
Min.: 3
Mult.: 1

Power Modules Half Bridge 1.2 kV 1.8 V 805 A 400 nA 1.923 kW SP6C - 40 C + 125 C Screw Mount Si
Microchip Technology APTGX600DA120T6G
Microchip Technology IGBT Modules PM-IGBT-TFS-SP6C Non-Stocked Lead-Time 26 Weeks
Min.: 4
Mult.: 1

Power Modules Single 1.2 kV 1.8 V 805 A 400 nA 1.923 kW SP6C - 40 C + 125 C Screw Mount Si
Microchip Technology APTGX600DU120T6G
Microchip Technology IGBT Modules PM-IGBT-TFS-SP6C Non-Stocked Lead-Time 26 Weeks
Min.: 3
Mult.: 1

Power Modules Dual Common Emitter 1.2 kV 1.8 V 805 A 400 nA 1.923 kW SP6C - 40 C + 125 C Screw Mount Si
Microchip Technology APTGX600SK120T6G
Microchip Technology IGBT Modules PM-IGBT-TFS-SP6C Non-Stocked Lead-Time 26 Weeks
Min.: 4
Mult.: 1

Power Modules Single 1.2 kV 1.8 V 805 A 400 nA 1.923 kW SP6C - 40 C + 125 C Screw Mount Si
Microchip Technology APTGX600U120D4G
Microchip Technology IGBT Modules PM-IGBT-TFS-D4 Non-Stocked Lead-Time 26 Weeks
Min.: 5
Mult.: 1

Power Modules Single 1.2 kV 1.8 V 805 A 400 nA 1.923 kW D4 - 40 C + 125 C Screw Mount Si
Microchip Technology APTGX75A120T1G
Microchip Technology IGBT Modules PM-IGBT-TFS-SP1F Non-Stocked Lead-Time 26 Weeks
Min.: 14
Mult.: 1

Power Modules Half Bridge 1.2 kV 1.8 V 120 A 150 nA 340 W SP1F - 40 C + 125 C Screw Mount Si
Microchip Technology APTGX800U120D4G
Microchip Technology IGBT Modules PM-IGBT-TFS-D4 Non-Stocked Lead-Time 26 Weeks
Min.: 4
Mult.: 1

Power Modules Single 1.2 kV 1.8 V 1.05 kA 400 nA 2.459 kW D4 - 40 C + 125 C Screw Mount Si
onsemi SNXH225B95H4Q2F2PG
onsemi IGBT Modules HUAWEI 15707 HP Q2BOOST (EXISTING DBC, 3X 10A SIC) Non-Stocked Lead-Time 18 Weeks
Min.: 1
Mult.: 1

Power Modules Module 950 V 1.8 V 65 A 400 nA 136 W Q2BOOST - 40 C + 125 C Press Fit SiC Tray