32 bit SMD/SMT Memory ICs

Types of Memory ICs

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Results: 326
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS Product Type Mounting Style Package/Case Memory Size Organisation Interface Type Minimum Operating Temperature Maximum Operating Temperature Packaging
Intelligent Memory DRAM SDRAM, 64Mb, 3.3V, 2Mx32, 166MHz (166Mbps), -40C to +85C, FBGA-54 Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-90 64 Mbit 2 M x 32 - 40 C + 85 C Tray
Intelligent Memory DRAM LPDDR4x 8Gb 256Mx32 2133MHz FBGA200 -20C to 85C Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-200 8 Gbit 256 M x 32 - 20 C + 85 C Tray
Intelligent Memory DRAM LPDDR4x 24Gb 768Mx32 2133MHz FBGA200 -40C to 85C Non-Stocked Lead-Time 10 Weeks
Min.: 120
Mult.: 120

DRAM SMD/SMT FBGA-200 24 Gbit 768 M x 32 - 40 C + 95 C Tray
Intelligent Memory DRAM ECC LPDDR4, 4Gb, 1.1V, 128Mx32, 1600MHz (3200Mbps), -40C to +95C, FBGA-200 Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Tray
Intelligent Memory DRAM ECC LPDDR4, 8Gb, 1.1V, 256Mx32, 1600MHz (3200Mbps), -40C to +95C, FBGA-200 Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-200 8 Gbit 256 M x 32 - 40 C + 95 C Tray
Infineon Technologies S80KS2564GACHA043
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT FBGA-49 256 Mbit - 40 C + 85 C Reel
Infineon Technologies S80KS2564GACHB040
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 260
Mult.: 260

DRAM SMD/SMT FBGA-49 256 Mbit - 40 C + 105 C Tray
Infineon Technologies CY14B116S-BZ35XI
Infineon Technologies NVRAM NVSRAM Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

NVRAM SMD/SMT FBGA-165 16 Mbit 512 k x 32 Parallel - 40 C + 85 C Tray
Infineon Technologies CY14B116S-BZ35XIT
Infineon Technologies NVRAM NVSRAM Non-Stocked Lead-Time 26 Weeks
Min.: 1 000
Mult.: 1 000
: 1 000

NVRAM SMD/SMT FBGA-165 16 Mbit 512 k x 32 Parallel - 40 C + 85 C Reel
ISSI DRAM 64M, 3.3V, 143Mhz 2Mx32 SDR SDRAM Non-Stocked Lead-Time 10 Weeks
Min.: 240
Mult.: 240

DRAM SMD/SMT BGA-90 64 Mbit 2 M x 32 - 40 C + 105 C Tray
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 105 C Reel
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Tray
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA(10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 105 C Tray
ISSI DRAM 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Reel
ISSI DRAM 512M, 2.5V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-90 512 Mbit 16 M x 32 - 40 C + 85 C Reel
ISSI DRAM 256M, 2.5V, Mobile SDRAM, 8Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-90 256 Mbit 8 M x 32 - 40 C + 85 C Reel
ISSI DRAM 512M, 3.3V, SDRAM, 16Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-90 512 Mbit 16 M x 32 - 40 C + 85 C Reel
ISSI DRAM 512M, 3.3V, SDRAM, 16Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-90 512 Mbit 16 M x 32 0 C + 70 C Reel
ISSI DRAM 512M, 3.3V, SDRAM, 16Mx32, 166MHz, 86 pin TSOP II, RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 1 500
Mult.: 1 500
: 1 500

DRAM SMD/SMT TSOP-II-86 512 Mbit 16 M x 32 - 40 C + 85 C Reel
ISSI DRAM 512M, 3.3V, SDRAM, 16Mx32, 166MHz, 86 pin TSOP II, RoHS T&R Non-Stocked Lead-Time 52 Weeks
Min.: 1 500
Mult.: 1 500
: 1 500

DRAM SMD/SMT TSOP-II-86 512 Mbit 16 M x 32 0 C + 70 C Reel
ISSI DRAM 512M, 3.3V, SDRAM, 16Mx32, 133Mhz at CL2 , 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 240
Mult.: 240

DRAM SMD/SMT BGA-90 512 Mbit 16 M x 32 0 C + 70 C Reel
ISSI DRAM 512M, 3.3V, SDRAM, 16Mx32, 133Mhz at CL2 , 90 ball BGA (8mmx13mm) RoHS, IT Non-Stocked Lead-Time 52 Weeks
Min.: 240
Mult.: 240

DRAM SMD/SMT BGA-90 512 Mbit 16 M x 32 - 40 C + 85 C Reel
ISSI DRAM 512M, 3.3V, SDRAM, 16Mx32, 133Mhz at CL2 , 90 ball BGA (8mmx13mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2 500
Mult.: 2 500
: 2 500

DRAM SMD/SMT BGA-90 512 Mbit 16 M x 32 - 40 C + 85 C Reel