Wakefield Thermal Featured Products
On-Chip Liquid Cold Plates
On-chip liquid cooling for high-power Intel Xeon® CPUs in dense AI and HPC racks.
Hydro-Air Liquid-to-Air Heat Exchangers
Compact liquid-to-air heat exchangers for high-power thermal management.
VC Series Vapor Chambers
Used to transport heat to a large area from a small source or a collection of small sources.
ulTIMiFlux Dielectric Phase Change TIM
Thermally conductive electrical insulators for semiconductor-to-heat sink interfaces
LCM-900 Liquid Chiller Module
Features 360W maximum power draw at 24VDC and vertical orientation within 30°.
LCM-600 Liquid Chiller Module
Features a hermetically sealed refrigeration system with a miniature variable-speed compressor.
FSW Friction Stir Welded Cold Plates
Features a solid-state welding method, which seamlessly joins metal pieces without melting them.
DST Double-Sided Adhesive Thermal Tape
Widely used to bond heat sinks to microprocessors and other power-consuming semiconductors.