ATS-UC-DFLOW-VC-200

Advanced Thermal Solutions
984-ATS-UCDFLOWVC200
ATS-UC-DFLOW-VC-200

Mfr.:

Description:
Heat Sinks Ultra Cool DualFLOW Heat Sink, 1U, Vapor Chamber

ECAD Model:
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In Stock: 4

Stock:
4 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 4 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
181,34 € 181,34 €

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
LGA2011, LGA2066
Screw
0.2 C/W
92.38 mm
92.11 mm
29 mm
Brand: Advanced Thermal Solutions
Packaging: Bulk
Product Type: Heat Sinks
Series: ATS-UC
Factory Pack Quantity: 5
Subcategory: Heat Sinks
Tradename: DualFLOW
Type: Component
Unit Weight: 479 g
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Attributes selected: 0

CAHTS:
8473309000
USHTS:
8473305100
JPHTS:
847330090
MXHTS:
8473300499
ECCN:
EAR99

dualFLOW™/quadFLOW™ CPU Coolers for Servers

Advanced Thermal Solutions dualFLOW™/quadFLOW™ CPU Coolers for Servers are designed for 1U and 2U applications where space and airflow are restricted. These heat sinks have a Pulse Width Modulation-enabled blower with 10.8VDC to 13.2VDC operating voltage. A vapor chamber base option improves heat spreading when the heat source is small or not uniform while an optional standard backing plate accommodates the cooling of any high-powered device. ATS dualFLOW/quadFLOW CPU Coolers offer at least 20% improvement over comparable products on the market. These devices have a nickel-plated finish.