A18909-06

Laird Technologies
739-A18909-06
A18909-06

Mfr.:

Description:
Thermal Interface Products Thickness 1.50mm 229x229mm Grey

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
10
Expected 25/01/2027
Factory Lead Time:
4
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
174,67 € 174,67 €
158,33 € 1 583,30 €

Product Attribute Attribute Value Select Attribute
Laird Technologies
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Ceramic Filled Silicone
6.2 W/mK
7 kV
Gray
- 50 C
+ 150 C
229 mm
229 mm
1.5 mm
UL 94 V-0
HR6.5
Bulk
Brand: Laird Technologies
Product Type: Thermal Interface Products
Factory Pack Quantity: 10
Subcategory: Thermal Management
Tradename: Tflex
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Attributes selected: 0

USHTS:
3919905060
ECCN:
EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

Tflex™ HR6.5 Thermal Gap Filler

Laird Technologies Tflex™ HR6.5 Thermal Gap Filler is a thermal interface material with >6W/mK thermal conductivity and high recovery properties. This filler is built to withstand cyclic gap changes due to shock, vibration, or warpage, providing consistent thermal performance over the part's life. HR6.5 material provides minimal stress on components, is easily assembled, and, in many cases, can be reused after rework due to its good rebound capability. Laird Technologies Tflex HR6.5 Thermal Gap Filler offers a 1mm to 5mm thickness range, ceramic-filled silicon sheet construction, a UL 94V-0 flammability rating, and a -50°C to +150°C operating temperature range.