DA14535-00000FX2

Renesas / Dialog
968-DA14535-00000FX2
DA14535-00000FX2

Mfr.:

Description:
RF System on a Chip - SoC Bluetooth Low Energy 5.3 SoC with integrated ARM Cortex-M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package

ECAD Model:
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In Stock: 2 762

Stock:
2 762 Can Dispatch Immediately
Factory Lead Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
1,91 € 1,91 €
1,65 € 16,50 €
1,56 € 39,00 €
1,38 € 138,00 €
1,29 € 322,50 €
1,22 € 610,00 €
1,16 € 1 160,00 €
Full Reel (Order in multiples of 4000)
1,07 € 4 280,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Renesas Electronics
Product Category: RF System on a Chip - SoC
RoHS:  
a Low Power Bluetooth 5.3 SoC
ARM Cortex M0+
1.8 V
3.6 V
- 40 C
+ 105 C
QFN-24
Reel
Cut Tape
MouseReel
ADC Resolution: 10 bit
Brand: Renesas / Dialog
Data Bus Width: 32 bit
Data RAM Size: 64 kB
Data RAM Type: RAM
Height: 0.65 mm
Interface Type: I2C, SPI, UART
Length: 3 mm
Maximum Clock Frequency: 16 MHz
Mounting Style: SMD/SMT
Number of ADC Channels: 4 Channel
Number of I/Os: 12 I/O
Number of Timers: 2
Operating Supply Voltage: 1.8 V to 3.6 V
Operating Temperature Range: - 40 C to + 105 C
Product Type: RF System on a Chip - SoC
Series: DA14535
Factory Pack Quantity: 4000
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
Tradename: SmartBond
Width: 2.2 mm
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CNHTS:
8542399000
CAHTS:
8542310000
USHTS:
8542310070
ECCN:
EAR99

DA14535 SmartBond TINY BLUETOOTH® LE 5.3 SoC

Renesas/Dialog DA14535 SmartBond TINY BLUETOOTH® Low Energy (BLE) 5.3 System on Chip (SoC) integrates a 2.4GHz transceiver and a 16MHz 32-bit Arm® Cortex®-M0+ microcontroller. This ultra-low-power SoC includes hardware for the Link Layer implementation of Bluetooth Low Energy and interface controllers for improved connectivity capabilities. The DA14535 SoC can be used as a data pump in hosted systems or as a standalone application processor. It is pin-to-pin compatible with the DA14531 and DA14530 SoCs.