It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

IMPC-07-P

Name: Samtec IMPC-07-P
Brand: Samtec
SKU: 200-IMPC-07-P
Price: 1.65 EUR
Availability: OutOfStock

Images are for reference only
See Product Specifications

Mouser No:

200-IMPC-07-P

Mfr. No:

IMPC-07-P

Mfr.:

Samtec

Description:

Power to the Board 2.00 mm mPOWER Discrete Wire Socket Housing

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

IMPC-07-P Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about Samtec IMPC-07-P

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	Power to the Board
Product Type:	Power to the Board
Series:	IMPC
Packaging:	Tube
Brand:	Samtec
Factory Pack Quantity:	24
Subcategory:	Power Connectors

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

IMPC-07-P Datasheet (PDF)

Compliance Codes

ECCN:: EAR99

Origin Classifications

Country of Origin:: United States
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

mPOWER® Ultra Micro Power Connectors

Samtec mPOWER^® Ultra Micro Power Connectors feature 2mm power blade interconnects, delivering up to 18A (460V_AC/651V_DC maximum) in a small form factor to support board-to-board and cable-to-board applications. The mPOWER connector system provides a versatile, high-power micro solution with exceptional design flexibility across a single product family. With a wide range of stack heights, the mPOWER series integrates easily into new or existing architectures. Discrete wire cable assemblies streamline board layout while efficiently delivering power directly to the system's active components.