LM75BIM-3/NOPB
See Product Specifications
Mfr.:
Description:
Board Mount Temperature Sensors Digital Temp Sensor
Datasheet
Application Notes
EOL
Images
Models
PCN
- Alternate Laser Marking Process Sequence for SOIC package (PDF)
- Product Change Notification (PDF)
- Product Change Notification (PDF)
- Qualification of copper wire as alternate bonding material for selected products in SOIC Package (PDF)
- Qualification of SID# 101380756 Mold Compound for Select SOIC Device(s) (PDF)
- TARIC:
- 8542399000
- CNHTS:
- 8542391090
- CAHTS:
- 8542390000
- USHTS:
- 8542390090
- JPHTS:
- 854239099
- MXHTS:
- 8542399999
- ECCN:
- EAR99
- Country of Origin:
- Philippines
- Assembly Country of Origin:
- Not available
- Country of Diffusion:
- Not available
Availability
-
Stock:
-
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Finland
