908-35-2-12-2-B-0

Wakefield Thermal
567-908-35-2-12-2-B
908-35-2-12-2-B-0

Mfr.:

Description:
Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 11.6mm Height, Aluminum

ECAD Model:
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In Stock: 47

Stock:
47 Can Dispatch Immediately
Factory Lead Time:
16 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
10,24 € 10,24 €
9,85 € 98,50 €
9,31 € 232,75 €
8,75 € 437,50 €
8,21 € 821,00 €
7,67 € 2 301,00 €
7,36 € 4 416,00 €
7,09 € 8 508,00 €

Product Attribute Attribute Value Select Attribute
Wakefield Thermal
Product Category: Heat Sinks
RoHS:  
Heat Sink Assemblies
Component, 35mm
Clip
Aluminum
Elliptical Pin
35 mm
35 mm
11.6 mm
Brand: Wakefield Thermal
Color: Black
Product Type: Heat Sinks
Series: 900
Factory Pack Quantity: 300
Subcategory: Heat Sinks
Type: Component
Unit Weight: 16,330 g
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Attributes selected: 0

TARIC:
8542900000
CNHTS:
8548000090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
MXHTS:
8542900100
ECCN:
EAR99

900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.