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XR-C452-0404C

Name: X-Microwave XR-C452-0404C
Brand: X-Microwave
SKU: 433-XR-C452-0404C
Price: 473.58 EUR
Availability: OutOfStock

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Mouser No:

433-XR-C452-0404C

Mfr. No:

XR-C452-0404C

Mfr.:

X-Microwave

Description:

RF Development Tools Band Pass Filters, B100MC5SSMT

More Information

Learn more about X-Microwave XR-C452-0404C

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	X-Microwave
Product Category:	RF Development Tools
RoHS:
Product:	Bandpass Filters
Type:	Band Pass Filter
Brand:	X-Microwave
Packaging:	Poly Bags
Product Type:	RF Development Tools
Series:	C452
Factory Pack Quantity:	1
Subcategory:	Development Tools
Part # Aliases:	B100MC5S

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Attributes selected: 0

Compliance Codes

TARIC:: 9030890000
USHTS:: 9030890100
KRHTS:: 9030890000
ECCN:: EAR99

Origin Classifications

Country of Origin:: United States
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Diplexers & Filters

X-Microwave Diplexers and Filters provide RF and microwave industry modular design technology. The X-Microwave Diplexers and Filters use X-MWblock^® modular building blocks, so engineers can quickly prototype and build efficient, cost-effective systems. Applications include wireless infrastructure, radar, navigation, transportation, quantum computing, medical devices, and test/measurement. These solutions support components from manufacturers like Akoustis, Analog Devices, Atlanta Micro, CTS, Knowles/DLI, Kyocera AVX, Marki Microwave, Microchip/Vectron, Mini-Circuits, Qorvo, X-Microwave, and TDK.

Get On The Grid

X-Microwave Get On The Grid is part of the X-Microwave System for RF and Microwave design. X-MWblocks revolutionize RF signal chain optimization with drop-in flexibility, negating the need for soldering or cumbersome evaluation board connections. These blocks are complemented by programming tools like the Raspberry Pi Controller, streamlining the design process. The X-MWblocks can be effortlessly moved from prototype plates into standard or custom connectorized housings, eliminating the need for solderless interconnects. The devices can be incorporated into a single PCB for more integrated solutions, replacing spring pins with soldered wires. Miniaturization is also an option, ensuring compatibility with other grid modules.