Router Switch & Network Applications

Bergquist Company Router Switch and Network Applications include phase change materials and thermally conductive adhesives designed to dissipate heat away from thermally sensitive components. The utilization of advanced materials in server motherboards and line cards for routers and switches offers benefits such as scale and cost reduction. One small uptick in performance, repeated thousands of times, provides a notable impact on router and switch performance. Thermal products from Bergquist Company help components function properly for optimal operation.

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Type
Package/Case
Material
Thermal Conductivity
Breakdown Voltage
Color
Minimum Operating Temperature
Maximum Operating Temperature
Length
Width
Thickness
Tensile Strength
Flammability Rating
Series
Packaging
Bergquist Company 2456488
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Tube, Gap Filler TGF 3500LVO / 3500LV
Datasheet
Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2478317
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge
Datasheet
Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2763109
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV
Datasheet
Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2763110
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV
Datasheet
Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 3041247
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

TGP 10000ULM
Bergquist Company 3041248
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

TGP 10000ULM
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.008" Thick, 11"x75' Roll
Datasheet

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.203 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.010" Thick, 11"x75' Roll
Datasheet

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.254 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.012" Thick, 11"x75' Roll
Datasheet

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 3.07 mm UL 94 V-0 THF 5000UT