XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.

Results: 19
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Number of Rows Pitch Termination Style Contact Plating Series Packaging
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 64In Stock
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 48In Stock
Min.: 1
Mult.: 1

Headers 24 Position 4 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 66In Stock
Min.: 1
Mult.: 1

Headers 36 Position 6 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 38In Stock
Min.: 1
Mult.: 1

Headers 36 Position 6 Row 1.8 mm Press Fit Gold Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 121In Stock
Min.: 1
Mult.: 1

Headers 48 Position 8 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 38In Stock
Min.: 1
Mult.: 1

Headers 32 Position 4 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 60In Stock
Min.: 1
Mult.: 1

Headers 48 Position 6 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 103In Stock
Min.: 1
Mult.: 1

Headers 64 Position 8 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 14In Stock
Min.: 1
Mult.: 1

Headers 96 Position 8 Row 1.8 mm Solder Pin HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 498Factory Stock Available
Min.: 1
Mult.: 1

Headers 96 Position 8 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Headers 4 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Headers 4 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Headers 8 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Headers 8 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Headers 4 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1

Headers 8 Row 1.8 mm Solder Pin Gold HDTM Tray