TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

Results: 15
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS Product Type Alloy Package Type
Chip Quik Solder Paste No-Clean 15g Sn63/Pb37 T4 190In Stock
620Expected 13/04/2026
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Solder Paste No-Clean 250g Sn63/Pb37 T4 35In Stock
69Expected 20/04/2026
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Solder Paste No-Clean 50g Sn63/Pb37 T4 208In Stock
363Expected 20/04/2026
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Solder Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4 157In Stock
213Expected 21/04/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Solder Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4 22In Stock
43Expected 20/04/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Solder Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4 116In Stock
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Solder Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5 126In Stock
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Solder Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5 105In Stock
203Expected 13/04/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Solder Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5 179In Stock
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Solder Paste No-Clean 35g Sn63/Pb37 T4 49In Stock
221Expected 13/04/2026
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Solder Paste No-Clean 500g Sn63/Pb37 T4 6In Stock
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik Solder Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4 32In Stock
95Expected 13/04/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Solder Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5 44In Stock
104Expected 13/04/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Solder Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4 Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik Solder Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5 N/A
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge