.050" LP Array™ Low Profile High-Density Arrays

Samtec .050 LP Array™ Low Profile, Open-Pin-Field High-Density Arrays feature a dual beam contact system on a 1.27mm x 1.27mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. The series is available in 4mm, 4.5mm, and 5mm mated heights with up to 320 total pins in 4-, 6- or 8-row configurations. These Samtec connectors support 28+ Gbps applications and are Final Inch® certified for Break Out Region trace routing recommendations to save time and be cost-effective. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

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Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
391In Stock
Min.: 1
Mult.: 1
Reel: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
153In Stock
Min.: 1
Mult.: 1
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
460In Stock
Min.: 1
Mult.: 1
Reel: 300

Headers 400 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
262In Stock
Min.: 1
Mult.: 1
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
151In Stock
2 100Expected 05/05/2026
Min.: 1
Mult.: 1
Reel: 700

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
2In Stock
Min.: 1
Mult.: 1
Reel: 550

LPAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
140In Stock
Min.: 1
Mult.: 1
Reel: 550

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
319In Stock
Min.: 1
Mult.: 1
Reel: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
289In Stock
Min.: 1
Mult.: 1
Reel: 300

LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
6In Stock
Min.: 1
Mult.: 1
Reel: 300

Headers 160 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
360In Stock
Min.: 1
Mult.: 1
Reel: 475

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
74In Stock
Min.: 1
Mult.: 1
Reel: 450

Headers 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
78In Stock
Min.: 1
Mult.: 1
Reel: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
33In Stock
300Expected 02/03/2026
Min.: 1
Mult.: 1
Reel: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
46In Stock
Min.: 1
Mult.: 1
Reel: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
15In Stock
Min.: 1
Mult.: 1
Reel: 700

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 700
Reel: 700

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1
Reel: 700

LPAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 700
Mult.: 700
Reel: 700

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
Non-Stocked Lead-Time 4 Weeks
Min.: 475
Mult.: 475
Reel: 475

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 700
Mult.: 700
Reel: 700

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1
Reel: 700
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 1.27MM LP ARRAY HS HD ARRAY
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 700
Mult.: 700
Reel: 700

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 650
Mult.: 650
Reel: 650

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
Non-Stocked Lead-Time 11 Weeks
Min.: 650
Mult.: 650
Reel: 650
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel