.050" LP Array™ Low Profile High-Density Arrays

Samtec .050 LP Array™ Low Profile, Open-Pin-Field High-Density Arrays feature a dual beam contact system on a 1.27mm x 1.27mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. The series is available in 4mm, 4.5mm, and 5mm mated heights with up to 320 total pins in 4-, 6- or 8-row configurations. These Samtec connectors support 28+ Gbps applications and are Final Inch® certified for Break Out Region trace routing recommendations to save time and be cost-effective. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

Results: 152
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Pitch Number of Rows Termination Style Mounting Angle Stack Height Current Rating Voltage Rating Maximum Data Rate Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Series Packaging
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 11 Weeks
Min.: 325
Mult.: 325
Reel: 325

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 10 Weeks
Min.: 450
Mult.: 450
Reel: 450

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 6 Weeks
Min.: 300
Mult.: 300
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 2 Weeks
Min.: 300
Mult.: 300
Reel: 300

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 11 Weeks
Min.: 450
Mult.: 450
Reel: 450

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 10 Weeks
Min.: 300
Mult.: 300
Reel: 300

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 2 Weeks
Min.: 300
Mult.: 300
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 2 Weeks
Min.: 300
Mult.: 300
Reel: 300

LPAM Reel
Samtec Board to Board & Mezzanine Connectors 1.27MM LP ARRAY HS HD LOW PRO Non-Stocked Lead-Time 10 Weeks
Min.: 475
Mult.: 475
Reel: 475

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 4 Weeks
Min.: 325
Mult.: 325
Reel: 325

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 6 Weeks
Min.: 300
Mult.: 300
Reel: 300

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 4 Weeks
Min.: 325
Mult.: 325
Reel: 325

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 8 Weeks
Min.: 300
Mult.: 300
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 4 Weeks
Min.: 450
Mult.: 450
Reel: 450

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 4 Weeks
Min.: 450
Mult.: 450
Reel: 450

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 3 Weeks
Min.: 300
Mult.: 300
Reel: 300

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 11 Weeks
Min.: 450
Mult.: 450
Reel: 450

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 3 Weeks
Min.: 450
Mult.: 450
Reel: 450

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 8 Weeks
Min.: 300
Mult.: 300
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 6 Weeks
Min.: 300
Mult.: 300
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 4 Weeks
Min.: 300
Mult.: 300
Reel: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 3 Weeks
Min.: 650
Mult.: 650
Reel: 650
No
LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 3 Weeks
Min.: 350
Mult.: 350
Reel: 350
No
LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 6 Weeks
Min.: 550
Mult.: 550
Reel: 550
No
LPAF Reel