XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options. 

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Number of Positions
Number of Rows
Pitch
Termination Style
Contact Plating
Series
Packaging
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Headers 4 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Headers 4 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Headers 8 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Headers 8 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1
Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1
Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1
Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1
Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Headers 4 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1

Headers 8 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1
Headers 24 Position 4 Row 1.8 mm Solder Pin Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1
Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1
Headers 24 Position 4 Row 1.8 mm Solder Pin Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1
Headers 24 Position 4 Row 1.8 mm Solder Pin Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1
Headers 36 Position 6 Row 1.8 mm Solder Pin Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1
Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1
Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1
Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1
Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1
Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1
Headers 48 Position 8 Row 1.8 mm Solder Pin Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1
Headers 48 Position 8 Row 1.8 mm Solder Pin Tray