2485264-1

TE Connectivity
571-2485264-1
2485264-1

Mfr.:

Description:
IC & Component Sockets DIP IC SOCKET 8P,GOLD FLASH

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 4 087

Stock:
4 087 Can Dispatch Immediately
Factory Lead Time:
9 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,826 € 0,83 €
0,70 € 7,00 €
0,62 € 15,50 €
0,59 € 66,08 €
0,553 € 154,84 €
0,531 € 267,62 €
0,505 € 509,04 €
0,473 € 1 191,96 €

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: IC & Component Sockets
RoHS:  
Sockets
8 Position
2 Row
DIP Socket
2.54 mm
Through Hole
Gold
7.62 mm
- 55 C
+ 125 C
Tube
Brand: TE Connectivity
Contact Material: Copper
Current Rating: 1 A
Flammability Rating: UL 94 V-0
Housing Material: Thermoplastic (TP)
Mounting Style: PCB Mount
Product Type: IC & Component Sockets
Factory Pack Quantity: 56
Subcategory: IC & Component Sockets
Products found:
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Attributes selected: 0

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TARIC:
8536693000
CNHTS:
8536909000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

DIP (Dual In-Line Package) Sockets

TE Connectivity's (TE) DIP (Dual In-Line Package) Sockets feature two contact configuration options for application flexibility: four-finger and dual leaf. The sockets provide a separable electrical and mechanical connection between the electronic component and the PCB, supporting quick mating and un-mating capability. The DIP sockets are available in open-frame and closed-frame housing with end-to-end and side-to-side stackable options. The DIP sockets' optimised design minimises the risk of the integrated circuit (IC) overheating during soldering and provides improved vibration resistance via the multi-contact beam design. The TE DIP Sockets are ideal for industrial controls, intelligent buildings, medical devices, military and other embedded system applications.