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2485265-1

Name: TE Connectivity 2485265-1
Brand: TE Connectivity
SKU: 571-2485265-1
Price: 2.58 EUR
Availability: InStock

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Mouser No:

571-2485265-1

Mfr. No:

2485265-1

Mfr.:

TE Connectivity

Description:

IC & Component Sockets DIP IC SOCKET 40P,GOLD FLASH

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

2485265-1 Datasheet

ECAD Model:

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More Information

Learn more about TE Connectivity 2485265-1

In Stock: 1 650

Stock:: 1 650 Can Dispatch Immediately

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Factory Lead Time:: 9 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

-,-- €

Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	2,58 €	2,58 €
	2,18 €	23,98 €
	1,94 €	42,68 €
	1,84 €	202,40 €
	1,74 €	440,22 €
	1,65 €	834,90 €
	1,63 €	4 088,04 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	IC & Component Sockets
RoHS:
Product:	Sockets
Number of Positions:	40 Position
Number of Rows:	2 Row
Type:	DIP Socket
Pitch:	2.54 mm
Termination Style:	Through Hole
Contact Plating:	Gold
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Tube
Brand:	TE Connectivity
Contact Material:	Copper
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	1 A
Flammability Rating:	UL 94 V-0
Housing Material:	Thermoplastic (TP)
Mounting Style:	PCB Mount
Product Type:	IC & Component Sockets
Factory Pack Quantity:	11
Subcategory:	IC & Component Sockets

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Datasheet

2485265-1 Datasheet

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TARIC:: 8536693000
USHTS:: 8536694040
ECCN:: EAR99

DIP (Dual In-Line Package) Sockets

TE Connectivity's (TE) DIP (Dual In-Line Package) Sockets feature two contact configuration options for application flexibility: four-finger and dual leaf. The sockets provide a separable electrical and mechanical connection between the electronic component and the PCB, supporting quick mating and un-mating capability. The DIP sockets are available in open-frame and closed-frame housing with end-to-end and side-to-side stackable options. The DIP sockets' optimised design minimises the risk of the integrated circuit (IC) overheating during soldering and provides improved vibration resistance via the multi-contact beam design. The TE DIP Sockets are ideal for industrial controls, intelligent buildings, medical devices, military and other embedded system applications.