32 bit Tray Embedded Solutions

Types of Embedded Solutions

Change category view
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS
Alliance Memory DRAM 512M 166MHz 16Mx32 Mobile LP SDRAM IT
348Expected 26/08/2026
Min.: 1
Mult.: 1

ISSI DRAM 256M, 3.3V, SDRAM, 8Mx32, 143Mhz, 86 pin TSOP II RoHS
216On Order
Min.: 1
Mult.: 1

Alliance Memory AS4C4M32SA-7TCN
Alliance Memory DRAM SDRAM, 128MB, 4M X 32, 3.3V, 86PIN TSOP II, 143 MHZ, COMMERCIAL TEMP - Tray
107Expected 24/06/2026
Min.: 1
Mult.: 1

Intelligent Memory DRAM LPDDR4x 24Gb 768Mx32 2133MHz FBGA200 -20C to 85C Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

Intelligent Memory DRAM SDRAM, 64Mb, 3.3V, 2Mx32, 166MHz (166Mbps), -40C to +85C, FBGA-54 Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

Intelligent Memory DRAM LPDDR4x 8Gb 256Mx32 2133MHz FBGA200 -20C to 85C Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

Intelligent Memory DRAM LPDDR4x 24Gb 768Mx32 2133MHz FBGA200 -40C to 85C Non-Stocked Lead-Time 10 Weeks
Min.: 120
Mult.: 120

Kingston DRAM 32Gb 200 ball LPDDR4 3733MHz -25c to 85c Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1
Max.: 20

Intelligent Memory DRAM ECC LPDDR4, 4Gb, 1.1V, 128Mx32, 1600MHz (3200Mbps), -40C to +95C, FBGA-200 Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

Intelligent Memory DRAM ECC LPDDR4, 8Gb, 1.1V, 256Mx32, 1600MHz (3200Mbps), -40C to +95C, FBGA-200 Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

Infineon Technologies Development Boards & Kits - Wireless CYW943907AEVAL1F EVAL KIT Non-Stocked Lead-Time 6 Weeks

Infineon Technologies S80KS2564GACHB040
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 260
Mult.: 260

Infineon Technologies CY14B116S-BZ35XI
Infineon Technologies NVRAM NVSRAM Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

ISSI DRAM 512M, 2.5V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 8 Weeks
Min.: 240
Mult.: 240

ISSI DRAM 512M, 3.3V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 8 Weeks
Min.: 240
Mult.: 240

ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS Lead-Time 4 Weeks
Min.: 1
Mult.: 1

ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 40 Weeks
Min.: 136
Mult.: 136

ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA(10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 40 Weeks
Min.: 136
Mult.: 136

ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked
Min.: 2 500
Mult.: 2 500

ISSI DRAM 512M, 2.5V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, IT Non-Stocked Lead-Time 16 Weeks
Min.: 240
Mult.: 240

ISSI DRAM 256M, 3.3V, Mobile SDRAM, 8Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, IT Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

ISSI DRAM 256M, 1.8V, 133Mhz 8Mx32 Mobile SDR Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

ISSI DRAM Automotive (-40 to +105C), 512M, 1.8V, Mobile DDR, 16Mx32, 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 24 Weeks
Min.: 240
Mult.: 240

ISSI DRAM 256M, 2.5V, Mobile SDRAM, 8Mx32, 166Mhz, 90 ball BGA (8mmx13mm) RoHS, IT Non-Stocked Lead-Time 16 Weeks
Min.: 240
Mult.: 240

ISSI DRAM 256M 8Mx32 143Mhz SDR SDRAM, 3.3V Non-Stocked
Min.: 240
Mult.: 240