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AC164326

Name: Microchip AC164326
Brand: Microchip Technology
SKU: 579-AC164326
Price: 364.64 EUR
Availability: OutOfStock

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Mouser No:

579-AC164326

Mfr. No:

AC164326

Mfr.:

Microchip Technology

Description:

Sockets & Adapters PM3 20L SOCKET MOD

Datasheet:

AC164326 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Microchip Technology AC164326

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	364,64 €	364,64 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Microchip
Product Category:	Sockets & Adapters
RoHS:
Product:	Socket Modules
For Use With:	MPLAB PM3
Brand:	Microchip Technology
Core:	PIC
Description/Function:	20L QFN Socket Module for MPLAB PM3
Interface Type:	RS-232, USB
Product Type:	Sockets & Adapters
Factory Pack Quantity:	1
Subcategory:	Embedded Solutions
Tool Is For Evaluation Of:	MPLAB PM3
Unit Weight:	134,717 g

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Datasheet

AC164326 Datasheet (PDF)

TARIC:: 8542319000
CNHTS:: 8542319000
USHTS:: 8473301180
MXHTS:: 8542310399
ECCN:: EAR99

Smart (Effortless Embedded Control Solutions)

Microchip Technology Effortless Embedded Control Solutions allow developers to effortlessly meet the ever-changing requirements of modern electronics with a portfolio of scalable 8-bit, 16-bit, and 32-bit microcontrollers, digital signal controllers, and microprocessors. Flexible peripherals and functions make creating differentiated applications that set you apart from your competition easy. Intuitive design environments and visual configuration tools provide a straightforward getting-started experience while proven reference designs and professionally tested software libraries lower your design risk.

Engineering Development Tools

Microchip Technology Engineering Development Tools offer a range of boards to support silicon products, from simple boards to high-end debug tools. These tools can be used in various applications and specific vertical markets like metering, motor control, and power supplies. These boards include analog and digital IC, communication, development software, embedded, optoelectronic, power management, RF/wireless, and sensor development.