Mobile Modules

Results: 5
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Supply Current Transmitting Supply Current Receiving Minimum Operating Temperature Maximum Operating Temperature Dimensions Protocol - Cellular, NBIoT, LTE
u-blox Mobile Modules LTE/HSPA+/GSM module for Europe/Asia Cat 4, B1, B3, B5, B7, B8, B20 PCIe card, 51x30 mm, MOQ 160pcs, on tray Non-Stocked
Min.: 160
Mult.: 160

u-blox Mobile Modules LTE/HSPA+/GSM module for Softbank (JP) Cat 4, B1, B3, B5, B7, B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray Non-Stocked
Min.: 160
Mult.: 160

1.9 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
u-blox Mobile Modules LTE Cat 4/HSPA+; Japan LTE: 1,3,5,8,19; 3G:1,8,19 PCIe card, 51x30 mm, MOQ 160pcs, on tray Non-Stocked
Min.: 160
Mult.: 160

u-blox Mobile Modules LTE Cat 4 only; Japan/NTT docomo LTE: 1,3,5,8,19 PCIe card, 51x30 mm, MOQ 160pcs, on tray Non-Stocked
Min.: 160
Mult.: 160

2.1 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
u-blox Mobile Modules LTE/HSPA+/GSM module LTE:B1,B3,B5,B7,B8,B28; 3G :B1,B2,B5,B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray Non-Stocked
Min.: 160
Mult.: 160

2.1 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE