HybridPACK™ Drive G2 Modules

Infineon Technologies HybridPACK™ Drive G2 Modules are compact power modules designed for hybrid and electric vehicle traction. The Infineon Technologies G2 modules offer scalable performance levels using Si or SiC technologies and different chipsets, maintaining the same module size. Introduced in 2017 with silicon EDT2 technology, it was optimized for efficiency in real-world driving. In 2021, a CoolSiC™ version was introduced, offering higher cell density and better performance. In 2023, the second generation, HybridPACK Drive G2, was launched with EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET technologies, providing ease of use and integration options for sensors, enabling up to 300kW performance within 750V and 1200V classes.

Results: 5
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Type Technology Vf - Forward Voltage Vr - Reverse Voltage Vgs - Gate-Source Voltage Mounting Style Package/Case Minimum Operating Temperature Maximum Operating Temperature Series Packaging
Infineon Technologies Discrete Semiconductor Modules HybridPACK Drive G2 module 3In Stock
Min.: 1
Mult.: 1

Power Modules Drive G2 Module SiC 1.76 V 400 V Press Fit DIP-7 - 40 C + 175 V HybridPACK Tray
Infineon Technologies Discrete Semiconductor Modules HybridPACK Drive G2 module with SiC MOSFET 5In Stock
Min.: 1
Mult.: 1

SiC MOSFET Modules Bridge Power Module SiC 4.64 V - 5 V, + 19 V Press Fit HybridPACK Tray
Infineon Technologies Discrete Semiconductor Modules HYBRID PACK DRIVE G2 SIC 11In Stock
Min.: 1
Mult.: 1

SiC G2 Tray
Infineon Technologies Discrete Semiconductor Modules HYBRID PACK DRIVE G2 SI 9In Stock
Min.: 1
Mult.: 1

Si G2 Tray
Infineon Technologies Discrete Semiconductor Modules HYBRID PACK DRIVE G2 SI 9In Stock
Min.: 1
Mult.: 1

Si G2 Tray