Die Sensor Interface

Results: 95
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Interface Type Supply Voltage - Max Supply Voltage - Min Operating Supply Current Minimum Operating Temperature Maximum Operating Temperature Mounting Style Package/Case ESD Protection Packaging
Texas Instruments Sensor Interface DIE SALE Non-Stocked Lead-Time 18 Weeks
Min.: 200
Mult.: 100

5.5 V 2.7 V 0 C + 70 C SMD/SMT Die
Texas Instruments Sensor Interface DIE SALE Non-Stocked Lead-Time 18 Weeks
Min.: 30
Mult.: 10

5.5 V 2.7 V 0 C + 70 C SMD/SMT Die
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 10 970
Mult.: 10 970

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 11 922
Mult.: 11 922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 11 922
Mult.: 11 922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 11 922
Mult.: 11 922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface DICE IN WAFFLE PACK Non-Stocked Lead-Time 18 Weeks
Min.: 1
Mult.: 1

Sensor Signal Conditioner I2C, SPI 3.6 V 1.68 V 1 mA - 40 C + 125 C SMD/SMT Die 4 kV Waffle
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 24 Weeks
Min.: 4 300
Mult.: 4 300

Sensor Signal Conditioner I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 10 970
Mult.: 10 970

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 11 922
Mult.: 11 922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 11 922
Mult.: 11 922

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 2 700
Mult.: 2 700

Sensor Signal Conditioner SMD/SMT Die Tray
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 12 000
Mult.: 12 000

SMD/SMT Die Gel Pack
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 12 000
Mult.: 12 000

SMD/SMT Die Gel Pack
ScioSense PS081 DICE
ScioSense Sensor Interface Resistance-to-digital converter dice in waffle pack Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

SMD/SMT Die
Renesas Electronics ZSC31014EAB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 8 500
Mult.: 8 500

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31014EIB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 8 500
Mult.: 8 500

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31050FAB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 2 900
Mult.: 2 900

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31050FEB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 2 900
Mult.: 2 900

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31050FIB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 2 900
Mult.: 2 900

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31150GAB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 24 Weeks
Min.: 2 800
Mult.: 2 800

SMD/SMT Die Gel Pack
Renesas Electronics ZSC31150GAD
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

SMD/SMT Die Waffle
Renesas Electronics ZSC31150GEB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 24 Weeks
Min.: 2 800
Mult.: 2 800

Sensor Signal Conditioner I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die With ESD Protection Gel Pack
Renesas Electronics ZSC31150GED
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

SMD/SMT Die Waffle
Renesas Electronics ZSSC3018BA2B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 16 000
Mult.: 16 000

Sensor Signal Conditioner I2C/SPI 3.6 V 1.68 V 1 mA - 40 C + 125 C SMD/SMT Die Gel Pack