XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options. 

Results: 126
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Number of Rows Pitch Termination Style Contact Plating Series Packaging
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 60In Stock
Min.: 1
Mult.: 1

Headers 32 Position 4 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 14In Stock
Min.: 1
Mult.: 1

Headers 96 Position 8 Row 1.8 mm Solder Pin HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
76Expected 07/09/2026
Min.: 1
Mult.: 1
HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header
60Expected 27/08/2026
Min.: 1
Mult.: 1

Headers 48 Position 6 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 2 216Factory Stock Available
Min.: 1
Mult.: 1

Headers 96 Position 8 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 404Factory Stock Available
Min.: 1
Mult.: 1
HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

Receptacles 4 Row 1.8 mm Solder Pin Gold HDTF Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

Receptacles 6 Row 1.8 mm Solder Pin Gold HDTF Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Receptacles 64 Position 8 Row 1.8 mm Press Fit Gold HDTF Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Receptacles 6 Row 1.8 mm Solder Pin Gold HDTF Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Receptacles 6 Row 1.8 mm Solder Pin Gold HDTF Bulk
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Receptacles 8 Row 1.8 mm Solder Pin Gold HDTF Bulk
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle Non-Stocked Lead-Time 11 Weeks
Min.: 1
Mult.: 1
HDTF Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Receptacles 36 Position 6 Row 1.8 mm Press Fit Gold HDTF Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle Non-Stocked Lead-Time 7 Weeks
Min.: 1
Mult.: 1
HDTF Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1
HDTF Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Headers 4 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

Headers 4 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Headers 8 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

Headers 8 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1
HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1
HDTM Tray
Samtec High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1
HDTM Tray