congatec CPU & Chip Coolers

Results: 101
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Height Depth Width Operating Supply Voltage Power Rating Series
JUMPtec CPU & Chip Coolers HSP COMe-bV26 Cu-core through Non-Stocked
Min.: 1
Mult.: 1

JUMPtec CPU & Chip Coolers HSP COMe-bTL6 Cu-core threaded Non-Stocked Lead-Time 22 Weeks
Min.: 1
Mult.: 1

JUMPtec CPU & Chip Coolers HSP COMe-bTL6 Cu-core through Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

JUMPtec CPU & Chip Coolers HSP COMe-bID7 (E2) Cu-core threaded Non-Stocked
Min.: 1
Mult.: 1

JUMPtec CPU & Chip Coolers HSP COMe-bID7 (E2) Cu-core through Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

JUMPtec CPU & Chip Coolers COMh Size D Active Uni Cooler (w/o HSP) Non-Stocked
Min.: 1
Mult.: 1

JUMPtec CPU & Chip Coolers COMh Size D Passive Uni Cooler (w/o HSP) Non-Stocked
Min.: 1
Mult.: 1

congatec CPU & Chip Coolers Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. Non-Stocked
Min.: 1
Mult.: 1
conga-QA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Passive cooling solution for Qseven module conga-QA7with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole. Non-Stocked
Min.: 1
Mult.: 1
conga-QA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded. Non-Stocked
Min.: 1
Mult.: 1
conga-QA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Passive cooling solution for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors.All standoffs are M2.5x0.45p threaded. Non-Stocked
Min.: 1
Mult.: 1
conga-QA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Passive cooling for Pico ITX board conga-PA7*For boards with IHS CPU*Four stand-offs threaded M2.5 Non-Stocked
Min.: 1
Mult.: 1

conga-PA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. bore hole Non-Stocked
Min.: 1
Mult.: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium and Celeron processor. bore hole Non-Stocked
Min.: 1
Mult.: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium and Celeron processor. thread Non-Stocked
Min.: 1
Mult.: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole. Non-Stocked Lead-Time 14 Weeks
Min.: 1
Mult.: 1

conga-MA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Passive cooling solution for COMe mini module conga-MA7 with open-die Intel Pentium/Celeron Nxxx processor. All standoffs are with 2.7mm bore hole. Non-Stocked
Min.: 1
Mult.: 1
conga-MA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Passive cooling solution for COMe mini module conga-MA7 with open-die Intel Pentium/Celeron Nxxx processor. All standoffs are M2.5 threaded Non-Stocked
Min.: 1
Mult.: 1
conga-MA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Passive cooling solution for SMARC 2.0 module conga-SA7* For modules with open-die Intel Pentium/Celeron processor* All stand-offs are with 2.7mm bore hole Non-Stocked
Min.: 1
Mult.: 1
conga-SA7 Intel Elkhart Lake
congatec CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. Non-Stocked Lead-Time 14 Weeks
Min.: 1
Mult.: 1
25.5 mm 12 VDC conga-TC570 Intel Tiger Lake-UP3
congatec CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. Non-Stocked
Min.: 1
Mult.: 1
25.5 mm 12 VDC conga-TC570 Intel Tiger Lake-UP3
congatec CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. Non-Stocked
Min.: 1
Mult.: 1
24.3 mm conga-TC570 Intel Tiger Lake-UP3
congatec CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. Non-Stocked
Min.: 1
Mult.: 1
24.3 mm conga-TC570 Intel Tiger Lake-UP3
congatec CPU & Chip Coolers Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. Non-Stocked
Min.: 1
Mult.: 1
29 mm 12 VDC conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU & Chip Coolers Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread. Non-Stocked
Min.: 1
Mult.: 1
29 mm 12 VDC conga-HPC/cTLU Intel Tiger Lake-UP3