Infineon Technologies DEMO_HV_PACKAGE Evaluation Board
Infineon Technologies DEMO_HV_PACKAGE Board enables designers to integrate bottom- and top-side cooled power packages efficiently into applications. This board assembly reduces design complexity to deliver optimal thermal performance while maximizing efficiency and achieving high power density. The DEMO_HV_PACKAGE board features reliability and scalability, enabling compact designs for high-performance power applications. This board features an improved power loop design, innovative cooling concepts such as BSC and TSC, an optimized half-bridge design, and lower stray inductance.
Features
- Faster and cheaper in production assembly
- Higher switching capabilities
- Better control and reduced power losses
- Possibility of double-sided PCB assembly
- Improved power loop design
- Innovative cooling concepts: BSC and TSC
- Optimized design of the half-bridge
- Lower stray inductance
- Kelvin source pin
- 3D concept of cooling and power loop integration
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Published: 2026-06-26
| Updated: 2026-07-07