TE Connectivity CAMM2 Memory Connectors
TE Connectivity's (TE) Compression Attached Memory Module 2 (CAMM2) Memory Connectors feature a next-generation memory module interface that is part of the Joint Electron Device Engineering Council (JEDEC) JESD318 standard. TE CAMM2 Memory Connectors are designed to replace traditional Small Outline Dual In-Line Memory Modules (SODIMMs) in laptops and compact computing devices. These connectors offer improved performance, enhanced thermal efficiency, and higher memory densities compared to previous-generation memory connectors. Applications include high-performance computing, embedded systems and Internet of Things (IoT) devices, automotive, aerospace and defense, medical devices, telecommunications and networking, AI and robotics, and consumer electronics.
Features
- Upgrade over previous-generation memory connectors
- Improved performance
- Improved thermal efficiency
- Higher memory densities
- Available in LGA644 and LGA666 configurations
- Next-generation memory module interface that is part of the JESD318 standard
- Replaces the SODIMMs in laptops and compact computing devices
Applications
- High-performance computing
- Embedded systems and IoT devices
- Automotive
- Aerospace and defense
- Medical devices
- Telecommunications and networking
- AI and robotics
- Consumer electronics