Infineon Technologies AIROC™ CYW43022 Wi-Fi® 5 & BLUETOOTH® Combo
Infineon Technologies AIROC™ CYW43022 Wi-Fi® 5 and BLUETOOTH® Combo features dual Wi-Fi 5 and Bluetooth 5.3 bands and up to 65% reduction in power usage during "deep sleep." This combo uses Wi-Fi network offloads and an embedded Bluetooth stack to reduce the power demands on host processors. The CYW43022 combo includes a Class 1 Bluetooth PA with +18dBm transmit power to support designs with smaller antennas or designs that require a longer reach. The single-chip combo is manufactured to address the needs of IoT devices that require minimal power consumption and a compact size. The included power management unit simplifies the system power topology while maximizing battery life. Infineon Technologies AIROC CYW43022 Wi-Fi and Bluetooth Combo is ideal for smart locks, smart wearables, IP cameras, and thermostats.
Features
- Wi-Fi
- Full IEEE 802.11ac compatibility with enhanced performance
- Supports MCS8 (256-QAM) for 20MHz channels
- 20MHz channels with optional SGI support for MCS0-MCS7
- IEEE 802.11ac explicit beamformer support
- TX and RX low-density parity check (LDPC) support for improved range and power efficiency
- Receive space-time block coding (STBC)
- On-chip power amplifier/low-noise amplifier for both bands
- Support for front-end modules (FEMS)
- Supports RF front-end architecture with a single dual-band antenna shared between Bluetooth and WLAN
- Shared Bluetooth and WLAN receive signal path
- Supports standard SDIO v2.0 and 80MHz/partial support only
- Backward compatible with SDIO v2.0 host interface
- Integrated Arm® processor with on-chip RAM and ROM
- Bluetooth
- Complies with Bluetooth core specification v5.3 and future specifications
- QDID
- Declaration ID
- Bluetooth 5.3-compliant with 2Mbps GFSK data rate for Bluetooth Low Energy
- All optional Bluetooth 4.2 features supported
- Bluetooth class 1 or class 2 transmitter operation
- Supports BDR (1Mbps), EDR (2/3Mbps), Bluetooth LE (1/2Mbps)
- Host controller interface (HCI) using a high-speed UART interface
- PCM for audio data
- Ultra-low TX O/P power mode to enable use cases such as proximity pairing
- Embedded Bluetooth host stack in ROM
- Low power consumption improves battery life of handheld devices
- Supports extended synchronous connections (eSCO)
- Supports multiple simultaneous advanced audio distribution profiles (A2DP) for stereo sound
- Adaptive frequency hopping (AFH) for reducing radio frequency interference
- Complies with Bluetooth core specification v5.3 and future specifications
- General
- Supports battery voltage range from 3.2V to 4.6V supplies with internal switching regulator
- "Deep sleep" mode and network offloads for ultra-low-power operation in battery-powered applications
- Programmable dynamic power management
- 6144 bits of OTP for storing board parameters
- 40 GPIOs
- 16 WLAN
- 4 Bluetooth
- 20 shared
- Security
- WPA, WPA2 (personal) with security improvements, WPA3 R3 (personal) support for power encryption and authentication
- AES and TKIP in hardware for faster data encryption and IEEE 802.11i compatibility
- Signed firmware image authentication
- Access restriction
- memory protection
- Remote procedure execution avoidance
- Packages
- 251-pin WLCSP package (3.76mm × 4.43mm, 0.2mm pitch)
- 106-ball WLBGA package (3.76mm x 4.43mm, 0.35mm pitch)
Applications
- Industrial IoT
- Smart homes
- Audio/Video/Voice
- Smart locks
- Wearables
- Smart TVs
- Gateways
- Handheld wireless systems
- IP cameras
- Thermostats
Resources
Associated Modules
Murata Type 2GF W-LAN+BLUETOOTH® Combo Module
Shielded ultra-small dual band Wi-Fi® 11a/b/g/n/ac+BLUETOOTH® 5.4 module for the Internet of Things.
Embedded Artists EAR00497 2GF M.2 Module
A drop-in certified solution featuring Murata's 2GF module, based on the Infineon CYW43022 chipset.
Block Diagram
Published: 2023-03-08
| Updated: 2025-06-24