IXYS MCMA Series High Powered Thyristor Modules feature multilayer module construction with a direct copper bonding (DCB) technique. The devices also feature top-side electrical terminals with captured nuts, series-connected thyristor/diode, and thyristor/thyristor modules. Power semiconductor modules compared to discrete designs are the electrical isolation between the baseplate of the module and the parts subject to voltage (3.6kVRMS to 4.8kVRMS tested). These make possible the mount-down of any number of the same or different modules on a common heatsink. The modules are designed for adequate clearance and creepage distance resulting in Recognition by Underwriters Laboratories (UL).