ReFLEX CES Vulcan System-on-Modules (SOMs)

ReFLEX CES Vulcan System-on-Modules (SoMs) are available in two versions: with a Versal™ Prime or an AI Edge FPGA System-on-Chip (SoC). This versatile platform combines artificial intelligence (AI) processing, advanced connectivity, and optimized performance, ideal for designing and deploying complex algorithms while integrating multiple functions on a single chip. The SOMs offer lower power consumption, enhanced system performance, and next-generation technology capabilities.

These ReFLEX CES SoMs are delivered with an active heatsink, complete with a heat spreader and fan, specifically tailored for embedded applications. Leveraging a SoM for a user's embedded system accelerates the design process and reduces time-to-market by offering pre-built, rigorously tested components for seamless system integration.

Target applications include bioscience/instrumentation, quantum computing, AI vision analytics, embedded airborne systems, radar systems, and military. The Vulcan Versal SoMs are fully compatible with the Vulcan carrier board, providing a complete and robust development solution.

Features

AMD Xilinx Versal Prime FPGA or AI Edge
VM2202 / VE2802
2x PCIe Gen4 x8 endpoint or root port
Dual-core Arm^® Cortex^® A-72 and dual-core Arm Cortex RSF
2x PCIe Gen4 x8 interface
44x HDIO + 48x XPIO

2x LP-DDR4, 1x MRAM ST-DDR4
Industrial temperature grade
Long-term supply
1-year technical support warranty
Fully compatible with the Vulcan carrier board
RoHS and REACH compliant

Applications

Bioscience and instrumentation
Quantum computing
AI vision analytics

Embedded airborne systems
Radar systems
Military

Specifications

Variants
- RXCVM2202PH35-SOM00I using Versal Prime VM2202
- RXCVE2802PH35-SOM00I using Versal AI Edge VE2802
FPGA SoC
- 1140 KLC
- 74Mbit ultraRAM
- 1312 DSP engines
- Dual-core Arm Cortex-A72
- Dual-core Arm Cortex-R5F
- Speed grade 1
- Industrial temperature grade
- 304 AI-Engines (RXCVE2802PH35-SOM00I only)
External memory
- Connected to the NOC = 1x LPDDR4 x64bit, 8GByte, at 2400MT/s
- 1x LPDDR4 x32bit, 1GByte, at 2400MT/s
- Connected to the PL = 1 bank MRAM 1Gbit
Mezzanine connectors
- 16x transceivers GTYP at 25Gbps + 16x transceivers GTYP CPM PCIe Gen4
- 44x HDIO maximum
- 48x XPIO maximum
2Gbit Quad SPI Flash FPGA configuration

128GB NAND Flash eMMC (stores U-Boot, Linux Kernel, and RootFS) software configuration
PS communication and networking
- 128GB eMMC
- 2Mbit EEPROM
- Min 1520Mb QSPI NOR Flash
- 54 PSIO (PMC and PS)
Board management controller (via Versal PMC)
- I²C and JTAG communication with the carrier board
- UART-to-FPGA communication with the FPGA
- Current, voltage, temperature, and ID information monitoring
- Clock programming
- Power and temperature protection control
84mm x 54mm (3.3" x 2.1") module size
5V ±10% rated
88W estimated total power with an active heatsink (heat spreader + heatsink)
-40°C to +85°C operating temperature range
UL 94V-0 compliant components