STMicroelectronics CAM-55G1 Promodule Camera Module

STMicroelectronics CAM-55G1 Promodule Camera Module is a sample camera module made for seamless evaluation and integration of the VD55G1 0.56-megapixel monochrome image sensor. The ready-to-use vision extensions integrate a VD55G1 image sensor, lens holder, lens, and plug-and-play flex connection in a tiny format down to 6.5mm². The CAM-55G1 leverages the complete toolbox of on-chip features of the embedded VD55G1 image sensor, such as autoexposure, auto-wake-up, background removal, or event-like mode. Multiple GPIOs enable users to synchronize the modules with triggers and illumination. Featuring a single-lane MIPI CSI-2 output and very low operating power, the promodules are ideally suited for embedded low-power setups.

The STMicroelectronics promodule reference features various lenses to match the needs of every application in terms of optical setup and mechanical constraints. All camera modules are equipped with an FPC-to-board connector and pinout. The plug-and-play architecture allows users to change promodules instantly and reuse the same setup with different lenses, color options, and even different image sensors in the ST BrightSense portfolio.

CAM-55G1 promodules can be tested and integrated on computers or embedded processing boards using hardware and software tools from STMicroelectronics. The compatible EVK Main and P-Board hardware kits enable straight connection to a PC and embedded processing platforms respectively. Evaluation GUI software and Linux drivers are available for download.

Features

“Promodules” turnkey camera modules for evaluation:
- Including a VD55G1 image sensor, lens holder, lens, and plug-and-play flex connection
- Lens focused, glued, and tested in a cleanroom environment using specialized equipment
- Small footprint down to 6.5mm², with smaller dimensions achievable as a customized solution from partner camera module integrators
Ultra-wide-angle lens for wide scene capture (160° DFOV), high lens flexibility

Plug-and-play connector to change the promodules at any time
- FPC-to-board 30-pin connector
- Same connector for all ST promodules
Ready for evaluation and integration
- On a computer with a USB output using the EVK Main hardware tool and the free Evaluation GUI software
- On embedded processing platforms with a MIPI CSI-2 output using the P-Board hardware tool and free Linux software tools

Applications

AR/VR and gaming
PC and personal electronics
Robotics and drones
Biometrics

Barcode reading and logistics
Security
Machine vision

Specifications

Image characteristics
- VD55G1 sensor
- 0.56MP resolution, 804 x 704
- Close to 1:1 aspect ratio
- Global shutter type
- Monochrome color option
Electrical characteristics
- FPC-to-board connector type
- Hirose BM28 B0.6-30DP/2-0.35V connector reference
- 30-pins
- MIPI CSI-2, one-lane output interface
- I²C control interface
- RAW8 and RAW10 output format
- 2.8V to 1.2V or 2.8V to 1.8V to 1.15V supply voltages
- 6MHz to 27MHz external clock frequency
Optical characteristics
- F/2.0 aperture (f/#)
- 160° D, 105° H, and 120° V field of view
- 0.825mm EFL
- 40cm -> ∞ depth of field
- <-76% TV distortion
- Clear filter
Mechanical characteristics
- 7.0mm x 7.0mm x 5.72mm (LxWxH) module head dimensions
- 12.4mm x 8.0mm x 5.72mm (LxWxH) module total dimensions
- 7.45mm distance from the connector to the optical center

Embedded
- Image quality optimization
  - Autoexposure
  - Automatic dark calibration
  - Noise reduction
  - Gamma correction
  - Defective pixel correction
  - Analog and digital gains
- Power and data optimization
  - Auto wake-up
  - Background removal
  - Event-like mode
  - Cropping
  - Binning
  - Subsampling
  - Context management with up to four contexts
- Mirror/flip
- Test pattern generation
- Temperature sensor
- 4x GPIOs