Samtec XCede® HD HDTF Right-Angle Backplane Receptacles
Samtec XCede® HD HDTF Right-Angle 1.8mm Backplane Receptacles feature a 1.8mm column pitch, 84 differential pairs per inch, and a modular design for application flexibility. These Samtec receptacles are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. The HDTF backplane receptacles are built with liquid crystal polymer (LCP) housing and copper alloy contact material. These receptacles are RoHS compliant and operate at -40°C to +105°C temperature range. XCede HD HDTF backplane receptacles mate with the XCede HD HDTM vertical backplane headers.
Features
- 3-, 4-, and 6-pair designs
- 4, 6, or 8 columns
- Standard or high-speed wafers available
- 85Ω and 100Ω options
- Modular design provides flexibility in applications
- LCP insulator material
- Copper alloy contact material
- -40°C to +105°C operating temperature range
- RoHS compliant
Dimensions (mm)
Associated Connectors
Samtec XCede® HD High-Density Backplane Systems
Combine a small form factor with incredible design flexibility for system and board space savings.
Samtec XCede® HD HPTS 3.20mm Power Modules
Feature press-fit tails and come in a variety of body heights to match signal module pair count.
Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers
Features a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins.
Associated Tooling Parts
Published: 2019-04-26
| Updated: 2023-07-18